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The main reasons and optimization solutions for the low dispensing efficiency of automatic dispensing machines

Publisher: Administrator Date: 2025-07-05

The main reasons and optimization solutions for the low dispensing efficiency of automatic dispensing machines are as follows: 

1、 Improper control of dispensing volume

Excessive dispensing can easily lead to glue overflow, while insufficient dispensing can affect the bonding strength. The dispensing time needs to be dynamically adjusted according to the characteristics of the glue and the ambient temperature.

2、 Improper setting of pressure parameters

Excessive pressure can cause glue splashing, while insufficient pressure can lead to glue breakage or leakage. It is necessary to calibrate the air pressure in real time based on the viscosity of the adhesive (such as viscosity decreasing when the temperature increases), and ensure the stability of the pressure supply system.

3、 Needle selection mismatch

The inner diameter of the needle should be 50% of the diameter of the glue point. A diameter that is too small will increase resistance, while a diameter that is too large will result in uncontrolled dispensing of adhesive; Needle wear or excessive length can also affect the consistency of adhesive dispensing, and it is necessary to replace the appropriate needle according to the product size. ‌

4、 Adhesive temperature control failure

Epoxy resin and other adhesives need to be stored at 0-5 ℃, and should be warmed up to 23 ℃ environment 30 minutes in advance before use. A temperature deviation of 5 ℃ can cause a 50% fluctuation in the amount of adhesive produced, and insufficient temperature recovery can easily lead to abnormal wire drawing or curing.

5、 Insufficient viscosity and bubble management

High viscosity glue is easy to draw, while low viscosity glue is easy to wet the solder pads. It is necessary to regularly test the viscosity and eliminate bubble interference through vacuum defoaming and sealed feeding system (bubbles can cause glue breakage or air damage).

6、 Process parameter synergy defect

Glue dispensing speed: too fast leads to insufficient glue, too slow leads to glue stacking;

Suction function: Improper setting can cause changes in residual adhesive volume (excessive suction reduces the next adhesive output, insufficient suction leads to dripping);

Curing curve: Failure to follow the manufacturer's temperature curve resulted in a decrease in bonding strength.

Optimization Summary

Improving efficiency requires collaborative regulation of equipment parameters (pressure, needle, suction), dynamic adaptation to the environment (temperature, viscosity), and strict control of adhesive quality (bubbles, storage). Regular maintenance of adhesive sealing and cleaning of the adhesive path can reduce abnormal downtime

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